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| HMICTM Integrated Passive Diplexer GSM/DCS or AMPS/PCS Applications 3 mm square MLP Plastic Package V 1.00 MA4DP918-1277 Features n n n n n n n 3mm MLP Plastic Package HMIC Integrated Passive Circuit Low Insertion Loss, High Rejection Diplexer Suface Mountable in Microwave Circuits, No Wirebonds Required Rugged HMICTM Construction with Polyamide Encapsulation Reliable, Multilayer Metalization No External 50 Matching Required Low Cost Miniature Plastic MLP Package TM Description The MA4DP918-1277 HMICTM Integrated Passive Diplexer is fabricated with the patented Heterolithic Microwave Integrated Circuit (HMIC) process. HMIC circuits consist of multilayer conductors on a glass dielectric, which acts as the low dispersion, low loss microstrip transmission medium. The glass allows HMIC devices to have excellent Q characteristics in a low profile, reliable device. Conductors are printed with state-of-the-art semiconductor photolithography processes and encapsulated in rugged silicon nitride and BCB polyamide. The circuit is composed of plated inductors and metal-insulator-metal (MIM) capacitors employing a silicon nitride dielectric layer. The high performance 3 mm MLP package allows for surface mount placement with no additional circuit matching required. PIN Configuration PIN Function GND NC RF 900 NC NC NC NC NC Paddle PIN 9 10 11 12 13 14 15 16 GND Function NC RF 1800 NC GND NC ANT NC NC 1 2 3 4 5 6 Applications The MA4DP918-1277 HMICTM Integrated Passive Diplexer is recommended for use in wireless dual band GSM/DCS or AMPS/PCS applications. The diplexer has low insertion loss in the pass bands and high rejection in the stop bands. All ports are matched to 50 ohms. 7 8 Absolute Maximum Ratings1 @ TA = +25 C (Unless otherwise specified) Parameter Operating Temperature Storage Temperature RF C.W. Incident Power Value -65 C to +125 C -65 C to +150 C 3 Watts C.W. Ordering Information Part Number MA4DP918-1277 MA4DP918-1277T Bulk Tape and Reel Package 1. Exceeding any of these values may result in permanent damage HMICTM Integrated Passive Diplexer for GSM/DCS or AMPS/PCS Applications MA4DP918-1277 V 1.00 Electrical Specifications @ 25 C ANT - RF 900 (AMPS / GSM) Freq (MHz) IL (dB) typ Freq (MHz) 2H Rej (dB) typ Freq (MHz) 3H Rej (dB) typ 825 0.55 1650 34 2475 15 880 0.63 1760 28 2640 15 960 0.88 1920 20 2880 16 Freq (MHz) IL (dB) typ Freq (MHz) Rej (dB) typ ANT - RF 1800 (PCS / DCS) 1710 0.75 825 35 1880 0.80 880 44 1990 0.91 960 33 2 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n North America: Tel. (800) 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 HMICTM Integrated Passive Diplexer for GSM/DCS or AMPS/PCS Applications MA4DP918-1277 V 1.00 Package Dimensions 3 M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. n North America: Tel. (800) 366-2266 n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300 |
Price & Availability of MA4DP918-1277
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